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This press release was originally distributed via the eWire press wire service (2002–2016). It is preserved here as a historical record.

R-Tec Holding Announces Solution to Solderless Interconnect

ARCHIVED 2002–2016: Originally distributed via the eWire press wire service. Preserved as historical record.

R-Tec Holding Announces Solution to Solderless Interconnect

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For Immediate Release

R-Tec Holding Announces Solution to Solderless Interconnect

IDAHO, BOISE, Oct. 19 -/E-Wire/-- R-Tec Holding, Inc. (OTC Bulletin Board: RTHG) through its subsidiary R-Tec Corporation, announced its new proprietary GCI(TM) II technology. Electronics companies are aiming to create "lead free' products due to the toxic effects of lead and the ban of such components in Europe. R-Tec believes the GCI(TM) II is a long-awaited solution, as it uses a solderless interconnect that eliminates the need for lead.

The GCI(TM) II technology is a high performance, invisible interface for solderless interconnects and other applications. Initial testing and use demonstrate a tolerance of handling extremely fast signals (tested from DC up to 20 GHz) in low cycle hits (1000 or less). GCI(TM) II is also an inexpensive solution that should be available as a high volume product with a short manufacturing cycle.

According to company president, Douglas G. Hastings, GCI(TM) II fits the new trend of "speed bump interface' technology for computer motherboards and will be a driving force for the growing RF market package. The release of this new technology should help R-Tec continue to be a leader in providing high-performance interconnects. Hastings also believes the new technology will have a positive material impact on R-Tec's future revenues.

R-Tec designs and manufactures high performance test sockets, burn-in sockets and IC interconnect devices for the IC chip industry. R-Tec also provides quality custom automation solutions to the high-tech industry through its consulting services, prototype development, tooling and manufacturing.

This release contains certain forward-looking statements, which are subject to a number of risks and uncertainties. Factors that could cause actual results to differ materially include: business conditions and growth in the IC chip industry and the general economy; variability of testing results; dependence on a limited number of customers; limited availability of components; problems associated with manufacturing the product in large volume; dependence on certain industries; variability of customer requirements; and other risk factors described in the company's most recently filed SEC documents such as its 10-KSB and 10-QSB filings.

To learn more about R-Tec Holding, Inc., visit our web site at www.rtec-holding.com or contact our sales division at (208) 887-0953.

http://www.rtec-holding.com

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